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SPK4-0.006-00-66

Thermal Interface Products The Original Polyimide-Based Insulator, 0.006" Thickness, Sil-Pad TSP K900/K-4

Part No:
SPK4-0.006-00-66
Mfr:
Bergquist Company
Description:
Thermal Interface Products The Original Polyimide-Based Insulator, 0.006" Thickness, Sil-Pad TSP K900/K-4
Product AttributeAttribute ValueSelect
Manufacturer
Bergquist Company
Product Category
Thermal Interface Products
RoHS
 Details
Product
Thermally Conductive Insulators
Type
Thermal Pad
Package / Case
Non-standard
Material
Silicone Elastomer
Thermal Conductivity
0.9 W/m-K
Breakdown Voltage
6 kVAC
Color
Gray
Minimum Operating Temperature
- 60 C
Maximum Operating Temperature
+ 180 C
Thickness
0.006 in
Tensile Strength
35 MPa
Series
K-4 / TSP K900
Brand
Bergquist Company
Product Type
Thermal Interface Products
Factory Pack Quantity: Factory Pack Quantity
100
Subcategory
Thermal Management
Tradename
Sil-Pad
Part # Aliases
2192545
USHTS
8546900000
ECCN
EAR99
Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

Enter Quantity:
Pricing (USD)
QtyUnit Price Ext. Price
Normal
2800 0.33USD 915.60
5000 0.31USD 1570.00
10000 0.30USD 3040.00

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