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SPK4-0.006-00-104

Thermal Interface Products The Original Polyimide-Based Insulator, 0.006" Thickness, Sil-Pad TSP K900/K-4

Part No:

SPK4-0.006-00-104

Mfr:

Bergquist Company

Description:

Thermal Interface Products The Original Polyimide-Based Insulator, 0.006" Thickness, Sil-Pad TSP K900/K-4

Product Attribute	Attribute Value	Select
Manufacturer	Bergquist Company
Product Category	Thermal Interface Products
RoHS	Details
Product	Thermally Conductive Insulators
Type	Thermal Pad
Package / Case	Non-standard
Material	Silicone Elastomer
Thermal Conductivity	0.9 W/m-K
Breakdown Voltage	6 kVAC
Color	Gray
Minimum Operating Temperature	- 60 C
Maximum Operating Temperature	+ 180 C
Thickness	0.006 in
Tensile Strength	35 MPa
Series	K-4 / TSP K900
Brand	Bergquist Company
Product Type	Thermal Interface Products
Factory Pack Quantity: Factory Pack Quantity	1
Subcategory	Thermal Management
Tradename	Sil-Pad
Part # Aliases	2191209

USHTS	3919905060
KRHTS	3919900000
MXHTS	3919909900
ECCN	EAR99

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

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