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IT3D-300S-BGA(57)
Board to Board & Mezzanine Connectors 300P RECPT SMT DETACHABLE SIDE SnPb
Product Attribute | Attribute Value | Select |
---|---|---|
Manufacturer | Hirose Electric | |
Product Category | Board to Board & Mezzanine Connectors | |
RoHS | Details | |
Product | Receptacles | |
Number of Positions | 300 Position | |
Pitch | 0.875 mm (0.034 in) | |
Termination Style | Solder | |
Mounting Angle | Vertical | |
Current Rating | 1 A | |
Voltage Rating | 50 V | |
Contact Plating | Gold | |
Contact Material | Copper Alloy | |
Housing Material | Liquid Crystal Polymer (LCP) | |
Series | IT3 | |
Packaging | Tray | |
Brand | Hirose Connector | |
Moisture Sensitive | Yes | |
Product Type | Board to Board & Mezzanine Connectors | |
Factory Pack Quantity: Factory Pack Quantity | 1 | |
Subcategory | Board to Board & Mezzanine Connectors |
USHTS | 8536694040 |
CNHTS | 8538900000 |
CAHTS | 8536690020 |
JPHTS | 853669000 |
KRHTS | 8536691000 |
TARIC | 8536693000 |
MXHTS | 8536699999 |
BRHTS | 85366990 |
ECCN | EAR99 |

IT3 High-Speed BGA Mezz Connectors
Hirose IT3 Series High-Speed BGA Mezz Connectors have the ability to transmit differential, single-ended, and power through one package. The stackable IT3 Series (from 15mm to 40mm) provides reliable connections for today's data rates of PCIe and XAUI, as well as the emerging 10+Gbps systems. Hirose IT3 Series High-Speed BGA Mezz Connectors feature a unique 3-piece structure for flexibility and a staggered 1.5mm x 1.75mm ball grid array. These connectors feature 100, 200, and 300 contacts (+90% additional grounds), low mating/extracting forces, wide misalignment tolerances for multiple connector use, and excellent reflow solderability.
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