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470-3235-600
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls
| Product Attribute | Attribute Value | Select |
|---|---|---|
| Manufacturer | Amphenol | |
| Product Category | Board to Board & Mezzanine Connectors | |
| RoHS | Details | |
| Product | Receptacles | |
| Number of Positions | 300 Position | |
| Pitch | 1.15 mm (0.045 in) | |
| Termination Style | BGA | |
| Mounting Angle | Vertical | |
| Stack Height | 26 mm, 28 mm, 30 mm, 33 mm | |
| Current Rating | 1 A | |
| Voltage Rating | 600 V | |
| Maximum Data Rate | 12.5 Gbps | |
| Minimum Operating Temperature | - 40 C | |
| Maximum Operating Temperature | + 105 C | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Housing Material | Liquid Crystal Polymer (LCP) | |
| Series | NeXLev | |
| Packaging | Tray | |
| Brand | Amphenol TCS | |
| Data Rate | 12.5 Gbps | |
| Product Type | Board to Board & Mezzanine Connectors | |
| Factory Pack Quantity: Factory Pack Quantity | 20 | |
| Subcategory | Board to Board & Mezzanine Connectors | |
| Tradename | NeXLev |
| USHTS | 8536694040 |
| CNHTS | 8538900000 |
| CAHTS | 8536690020 |
| JPHTS | 853669000 |
| KRHTS | 8536691000 |
| TARIC | 8536693000 |
| MXHTS | 8536699999 |
| BRHTS | 85366990 |
| ECCN | EAR99 |
NeXLev® High-Density Parallel B2B Connectors
Amphenol TCS NeXLev® High-Density Parallel B2B Connectors are capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design includes up to 57 real signals per linear centimeter (145 signals per linear inch), a ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.
NeXLev® Parallel Board-to-Board Connectors
Amphenol TCS NeXLev® product line features High-Density Parallel Board-to-Board Connectors capable of handling data rates up to 12.5Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance.
